Invention Grant
- Patent Title: Microwave-transmitting mould structure and method for using the same
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Application No.: US16635557Application Date: 2018-04-11
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Publication No.: US11472073B2Publication Date: 2022-10-18
- Inventor: Hui-Chen Chiu , Ting-Ti Huang , Ya-Chi Wang
- Applicant: SUNKO INK CO., LTD.
- Applicant Address: CN Taichung
- Assignee: SUNKO INK CO., LTD.
- Current Assignee: SUNKO INK CO., LTD.
- Current Assignee Address: CN Taichung
- Agency: Bruce Stone LLP
- Agent Joseph A. Bruce
- International Application: PCT/CN2018/082662 WO 20180411
- International Announcement: WO2019/196029 WO 20191017
- Main IPC: B29C44/34
- IPC: B29C44/34 ; B29C33/38 ; B29C44/58 ; B29K105/04 ; B29L31/50

Abstract:
Disclosed is a microwave-transmitting mould structure, comprising a first template, a second template and a mould combining unit. The mould combining unit has a first snap fit, a second snap fit and an engagement member. The first snap fit is arranged on the first template; the second snap fit is arranged on the second template; and the engagement member is snap-fit engaged between the first snap fit and the second snap fit, so that when the first template and the second template are subjected to an outward pressure, corresponding faces thereof which the engagement member can pass through respectively abut against abutting faces of the first snap fit and of the second snap fit, and thus, the first template and the second template cannot be separated from each other due to an increased pressure inside the mould.
Public/Granted literature
- US20210016475A1 MICROWAVE-TRANSMITTING MOULD STRUCTURE AND METHOD FOR USING THE SAME Public/Granted day:2021-01-21
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