Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
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Application No.: US16850557Application Date: 2020-04-16
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Publication No.: US11476051B2Publication Date: 2022-10-18
- Inventor: Bum Soo Kim , Jin Soo Park , Duk Hyun Chun , Myung Jun Park , Yeon Song Kang , Jong Ho Lee , Hyun Hee Gu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0002913 20200109
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/012

Abstract:
A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.
Public/Granted literature
- US20210217560A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-07-15
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