- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US17002433Application Date: 2020-08-25
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Publication No.: US11476128B2Publication Date: 2022-10-18
- Inventor: Jenchun Chen , An-Ping Chien
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H01L21/50 ; H01L21/60
Abstract:
The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.
Public/Granted literature
- US20220068665A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-03-03
Information query
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