Invention Grant
- Patent Title: Bonded structures without intervening adhesive
-
Application No.: US16741575Application Date: 2020-01-13
-
Publication No.: US11476213B2Publication Date: 2022-10-18
- Inventor: Belgacem Haba , Rajesh Katkar , Ilyas Mohammed , Javier A. DeLaCruz
- Applicant: INVENSAS BONDING TECHNOLOGIES, INC.
- Applicant Address: US CA San Jose
- Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
- Current Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Jose
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/78

Abstract:
A bonded structure can include a first reconstituted element comprising a first element and having a first side comprising a first bonding surface and a second side opposite the first side. The first reconstituted element can comprise a first protective material disposed about a first sidewall surface of the first element. The bonded structure can comprise a second reconstituted element comprising a second element and having a first side comprising a second bonding surface and a second side opposite the first side. The first reconstituted element can comprise a second protective material disposed about a second sidewall surface of the second element. The second bonding surface of the first side of the second reconstituted element can be directly bonded to the first bonding surface of the first side of the first reconstituted element without an intervening adhesive along a bonding interface.
Public/Granted literature
- US20200227367A1 BONDED STRUCTURES Public/Granted day:2020-07-16
Information query
IPC分类: