Invention Grant
- Patent Title: Infrared image sensor component manufacturing method
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Application No.: US16659405Application Date: 2019-10-21
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Publication No.: US11476288B2Publication Date: 2022-10-18
- Inventor: Chien-Ying Wu , Li-Hsin Chu , Chung-Chuan Tseng , Chia-Wei Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A method includes epitaxially growing a first III-V compound layer over a semiconductive substrate. A second III-V compound layer is epitaxially grown over the first III-V compound layer. A source/drain contact is formed over the second III-V compound layer. A gate structure is formed over the second III-V compound layer. A pattern is formed shielding the gate structure and the source/drain contact, in which a portion of the second III-V compound layer is free from coverage by the pattern.
Public/Granted literature
- US20200052018A1 INFRARED IMAGE SENSOR COMPONENT MANUFACTURING METHOD Public/Granted day:2020-02-13
Information query
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