Invention Grant
- Patent Title: Electrode pressure-bonding device
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Application No.: US16743179Application Date: 2020-01-15
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Publication No.: US11476491B2Publication Date: 2022-10-18
- Inventor: Masayuki Sumita , Hideyasu Kamigawa , Takeshi Yamamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JPJP2017-139039 20170718
- Main IPC: H01M4/04
- IPC: H01M4/04 ; H01M10/0585 ; H01M10/04

Abstract:
An electrode pressure-bonding device that includes a feeding device that feeds a separator material in a strip shape in a feeding direction; a support stage under the separator material and configured to support an electrode on the separator material with the separator material interposed between the electrode and the support stage; and a pressure-bonding device that holds the separator material and the electrode together and pressure-bonds at least part of the separator material to the electrode.
Public/Granted literature
- US20200153027A1 ELECTRODE PRESSURE-BONDING DEVICE Public/Granted day:2020-05-14
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