In a method for manufacturing lamination stacks of controlled height in a tool, starting material is provided as continuous strip delivered from a coil or as an individual sheet. Laminations are punched from the starting material in several punching steps to a required contour of the laminations. A heat-curing adhesive is applied onto the laminations prior to performing a last punching step. The laminations are combined to a lamination stack. The laminations of the lamination stack are partially or completely heated in a lamination storage. The adhesive is liquefied by heating the lamination stack to build up adhesion and then solidified. Curing the adhesive at the liquefying temperature or solidifying the adhesive in the tool by cooling and subsequently heating the adhesive to a temperature below the liquefying temperature is possible so that the adhesive does not melt but undergoes further curing resulting in higher temperature stability.