Invention Grant
- Patent Title: Elastic wave device
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Application No.: US16278839Application Date: 2019-02-19
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Publication No.: US11476830B2Publication Date: 2022-10-18
- Inventor: Mari Saji
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2018-050602 20180319
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H01L41/047 ; H03H9/145 ; H03H9/25

Abstract:
In an elastic wave device, an IDT electrode is provided on a piezoelectric substrate and a first silicon oxide film covers the IDT electrode. A high-acoustic-velocity dielectric film covers the first silicon oxide film. A second silicon oxide film is provided on the high-acoustic-velocity dielectric film. The piezoelectric substrate is made of lithium niobate. The high-acoustic-velocity dielectric film propagates longitudinal waves at an acoustic velocity higher than an acoustic velocity of longitudinal waves propagating through the first silicon oxide film. The high-acoustic-velocity dielectric film is provided at a distance of about (t1+t2)×0.42 or less from a first main surface of the piezoelectric substrate in a thickness direction of the piezoelectric substrate.
Public/Granted literature
- US20190288664A1 ELASTIC WAVE DEVICE Public/Granted day:2019-09-19
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