Invention Grant
- Patent Title: Surface acoustic wave device
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Application No.: US16162791Application Date: 2018-10-17
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Publication No.: US11476831B2Publication Date: 2022-10-18
- Inventor: Yasuhiko Hirano , Daisuke Sekiya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JP2015-252619 20151224
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H9/02 ; H03H9/10

Abstract:
A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate, a plurality of partition-support layers each of which is arranged in a region of the main surface surrounded by an outer periphery of the main surface, and a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode. The plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other, and a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from a second direction perpendicular or substantially perpendicular to a first direction in which the plurality of partition-support layers extend.
Public/Granted literature
- US20190052242A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2019-02-14
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