In accordance with some aspects of the disclosure, a modular telecommunications patch panel system is shown and described. The panel can include a mounting frame extending between a first end and a second end, the mounting frame defining a plurality of apertures for receiving telecommunications components, a first mounting ear forming a snap-fit connection with the mounting frame first end, in a first orientation, and a second mounting ear, identical to the first mounting ear, forming a snap-fit connection with the mounting frame second end, in a second orientation.