Invention Grant
- Patent Title: Component mounting device
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Application No.: US16619451Application Date: 2017-06-06
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Publication No.: US11477928B2Publication Date: 2022-10-18
- Inventor: Kunimune Komaike
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Iwata
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Iwata
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/020970 WO 20170606
- International Announcement: WO2018/225151 WO 20181213
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/00 ; H05K13/02 ; H05K13/08

Abstract:
A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.
Public/Granted literature
- US20200163264A1 COMPONENT MOUNTING DEVICE Public/Granted day:2020-05-21
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