Invention Grant
- Patent Title: Coil electronic component
-
Application No.: US16522136Application Date: 2019-07-25
-
Publication No.: US11482370B2Publication Date: 2022-10-25
- Inventor: Jae Hun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0055469 20190513
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
A coil electronic component includes a body comprising a magnetic material, an insulating substrate comprising a support portion disposed inside the body, and a tip extending from the support portion and exposed from an external surface of the body, a coil portion disposed on the support portion, and a lead-out portion extending from one end of the coil portion, disposed on the tip, and exposed from the external surface of the body. The lead-out portion has a slit exposed from the external surface of the body.
Information query