Invention Grant
- Patent Title: Joining body
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Application No.: US16697971Application Date: 2019-11-27
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Publication No.: US11485092B2Publication Date: 2022-11-01
- Inventor: Yoshiki Kuwahara , Ryuichi Kitora , Akihiro Yamamura , Shogo Okamoto , Masashi Nakamura , Shinichiro Yoshida
- Applicant: Mitshubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitshubishi Electric Corporation
- Current Assignee: Mitshubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2014-218005 20141027
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B29C65/08 ; H02K3/38 ; H02K3/50 ; H02K15/04 ; H02K3/52 ; B29C65/00 ; H02K15/00 ; B29C65/56 ; B29C65/34 ; H02K1/12 ; H02K15/02 ; F16B17/00 ; B29K701/12 ; B29K705/00 ; B29L31/00

Abstract:
The present invention is provided with: an insulation holder formed of a thermoplastic resin material and having a first opening; a wire connection ring formed of a thermoplastic resin material and having a second opening; and a joining component inserted astride in the first opening and the second opening, the joining component being formed of a metal material having a higher melting point than those of the thermoplastic resin materials, the joining component having a higher stiffness than those of the insulation holder and the wire connection ring, wherein a welded part is formed by welding in at least a part of an area where each of the insulation holder and the wire connection ring has contact with the joining component.
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