Invention Grant
- Patent Title: Formaldehyde free adhesive composition
-
Application No.: US17299623Application Date: 2019-03-07
-
Publication No.: US11485886B2Publication Date: 2022-11-01
- Inventor: Shi Pan , Minbiao Hu , Tong Sun , Xuemei Zhai , Shaoguang Feng , Yan Li , Jingui Jiang
- Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
- Applicant Address: US MI Midland; US MI Midland
- Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee Address: US MI Midland; US MI Midland
- Agent Zhiqiang Zhao
- International Application: PCT/CN2019/077266 WO 20190307
- International Announcement: WO2020/177111 WO 20200910
- Main IPC: C09J133/08
- IPC: C09J133/08 ; B32B37/12 ; C09J5/00 ; B32B7/12 ; B32B21/13
Abstract:
A formaldehyde free adhesive composition and a plywood obtained from the adhesive composition is provided, and the plywood has a balanced performance, such as high adhesion strength, sufficient pot-life, and good workability.
Public/Granted literature
- US20220017795A1 FORMALDEHYDE FREE ADHESIVE COMPOSITION Public/Granted day:2022-01-20
Information query
IPC分类:
