Invention Grant
- Patent Title: Isolated hall sensor structure
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Application No.: US16897851Application Date: 2020-06-10
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Publication No.: US11486944B2Publication Date: 2022-11-01
- Inventor: Maria-Cristina Vecchi , Reinhard Erwe , Martin Cornils , Kerwin Khu
- Applicant: TDK-Micronas GmbH
- Applicant Address: DE Freiburg
- Assignee: TDK-Micronas GmbH
- Current Assignee: TDK-Micronas GmbH
- Current Assignee Address: DE Freiburg
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: DE102019004060.0 20190611
- Main IPC: G01R33/07
- IPC: G01R33/07 ; H01L43/04 ; H01L43/06 ; G01R33/06

Abstract:
An isolating Hall sensor structure having a support structure made of a substrate layer and an oxide layer, a semiconductor region of a first conductivity type which is integrally connected to a top side of the oxide layer, at least one trench extending from the top side of the semiconductor region to the oxide layer of the support structure, at least three first semiconductor contact regions of the first conductivity type, each extending from a top side of the semiconductor region into the semiconductor region. The at least one trench surrounds a box region of the semiconductor region. The first semiconductor contact regions are each arranged in the box region of the semiconductor region and are each spaced apart from one another. A metallic connection contact layer is arranged on each first semiconductor contact region.
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