Invention Grant
- Patent Title: Press-pack semiconductor fixtures
-
Application No.: US17178687Application Date: 2021-02-18
-
Publication No.: US11488927B2Publication Date: 2022-11-01
- Inventor: Thomas Kendzia, III , Gilbert Taylor Miller
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Greenberg Traurig, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/50 ; H01L23/051

Abstract:
A press-pack semiconductor fixture 200 includes a housing defining an interior passage. A first conductor and a second conductor are mechanically coupled with the housing. The mechanical coupling of the first conductor and the second conductor with the housing is effective to apply a clamping force to a press pack semiconductor. A number of apertures or openings are provided in the housing, the first conductor, and the second conductor to permit fluidic flow 290 between the interior passage 239 and spaces or structures exterior to the housing.
Public/Granted literature
- US20220262763A1 PRESS-PACK SEMICONDUCTOR FIXTURES Public/Granted day:2022-08-18
Information query
IPC分类: