Invention Grant
- Patent Title: Sizing apparatus
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Application No.: US16640096Application Date: 2017-08-21
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Publication No.: US11491540B2Publication Date: 2022-11-08
- Inventor: Shinji Hayashi , Kenji Takeuchi
- Applicant: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
- Applicant Address: JP Takahashi
- Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
- Current Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
- Current Assignee Address: JP Takahashi
- Agency: Faegre Drinker Biddle & Reath LLP
- International Application: PCT/JP2017/029828 WO 20170821
- International Announcement: WO2019/038816 WO 20190228
- Main IPC: B29C43/08
- IPC: B29C43/08 ; B22F3/03 ; B30B11/10

Abstract:
Provided is a sizing apparatus including: a die set including a die plate that holds a die provided with a through hole to which a workpiece is to be supplied, and upper and lower punches that are to be inserted into the through hole to press the workpiece; a press main body that includes punch driving mechanisms that actuate the punches and in which the die set is configured to be attached to and detached from a predetermined position; and a turntable that is rotated on the die plate and supplies a workpiece to the die and discharges a workpiece from the die. The die set includes the turntable, and a supporting base on which the turntable is placed. The supporting base includes an axis positioning portion that is provided coaxially with a central axis of the turntable and positions the central axis at a predetermined position of the supporting base.
Public/Granted literature
- US20210129219A1 SIZING APPARATUS, AND METHOD FOR MANUFACTURING SINTERED BODY Public/Granted day:2021-05-06
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