Invention Grant
- Patent Title: Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components
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Application No.: US16610966Application Date: 2018-05-07
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Publication No.: US11491567B2Publication Date: 2022-11-08
- Inventor: Aaron Hutzler , Christoph Oetzel
- Applicant: PINK GmbH Thermosysteme
- Applicant Address: DE Wertheim
- Assignee: PINK GmbH Thermosysteme
- Current Assignee: PINK GmbH Thermosysteme
- Current Assignee Address: DE Wertheim
- Agency: Dinsmore & Shohl LLP
- Priority: DE102017109747.3 20170505,DE202017105174.9 20170828
- International Application: PCT/EP2018/061727 WO 20180507
- International Announcement: WO2018/202919 WO 20181108
- Main IPC: B23K3/08
- IPC: B23K3/08 ; B23K1/00 ; H01L23/00 ; B23K1/20 ; H01L25/065 ; H01L25/00 ; B23K101/42
Abstract:
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected.
It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.
It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.
Information query
IPC分类:
