- Patent Title: Silicon bond coat with columnar grains and methods of its formation
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Application No.: US16050379Application Date: 2018-07-31
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Publication No.: US11492298B2Publication Date: 2022-11-08
- Inventor: Glen Harold Kirby , Justin Michael Nagy , John Tam Nguyen , Jeffery Allen Bross , Brian Harvey Pilsner , Robert Martin Fecke
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: C04B14/00
- IPC: C04B14/00 ; C04B41/00 ; C04B41/50 ; F01D5/28 ; C23C28/00 ; C23C30/00

Abstract:
Methods for forming a coated component, along with the resulting coated components, are provided. The method may include forming a silicon-based bond coating on a surface of a substrate and forming a barrier coating on the silicon-based bond coating. The silicon-based bond coating comprises columnar grains of crystalline silicon. Chemical vapor depositing (CVD) may be used to form the silicon-based bond coating through CVD of a silicon-containing precursor at a deposition temperature and deposition pressure that causes crystallization of the silicon material during the deposition of the silicon-based bond coating. The silicon-containing precursor may be silane, monochlorosilane, dichlorosilane, and/or trichlorosilane.
Public/Granted literature
- US20200039892A1 Silicon Bond Coat With Columnar Grains and Methods of its Formation Public/Granted day:2020-02-06
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