Invention Grant
- Patent Title: Epoxy compound, resist composition, and pattern forming process
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Application No.: US16800447Application Date: 2020-02-25
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Publication No.: US11492337B2Publication Date: 2022-11-08
- Inventor: Masayoshi Sagehashi , Ryosuke Taniguchi , Takeru Watanabe , Yoshinori Matsui
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: WHDA, LLP
- Priority: JPJP2019-040260 20190306
- Main IPC: C07D303/06
- IPC: C07D303/06 ; G03F7/004 ; G03F7/038 ; G03F7/039 ; C08F212/08 ; C08F220/38 ; C08L33/14
Abstract:
An epoxy compound of formula (1) is provided. A resist composition comprising the epoxy compound is capable of adequately controlling the diffusion length of acid generated from an acid generator without sacrificing sensitivity.
Public/Granted literature
- US20200283400A1 EPOXY COMPOUND, RESIST COMPOSITION, AND PATTERN FORMING PROCESS Public/Granted day:2020-09-10
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