Invention Grant
- Patent Title: Latex composition for dip molding, a method of preparing the same, and molded article therefrom
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Application No.: US16971162Application Date: 2019-11-01
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Publication No.: US11492466B2Publication Date: 2022-11-08
- Inventor: Won Sang Kwon , Seung Uk Yeu , Seung Whan Oh , Yong Seok Jung , Jung Su Han
- Applicant: LG Chem, Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2018-0157210 20181207
- International Application: PCT/KR2019/014709 WO 20191101
- International Announcement: WO2020/116793 WO 20200611
- Main IPC: C08L13/02
- IPC: C08L13/02 ; C08L9/04

Abstract:
Provided is a latex composition for dip molding. The latex composition for dip molding includes a carboxylic acid-modified nitrile-based copolymer latex and a hydrophobically modified alkali-soluble emulsion thickener, wherein the hydrophobically modified alkali-soluble emulsion thickener includes a copolymer including an associative portion and a non-associative portion, and the associative portion includes a monomer-derived repeating unit substituted by one or more first hydrophobic groups selected from the group consisting of alkyl, alkenyl, perfluoroalkyl, and carbosilyl having 8 to 15 carbon atoms, and aryl, arylalkyl, arylalkenyl, alicyclic alkyl, and polycyclic alkyl having 6 to 15 carbon atoms. A method of preparing the latex composition for dip molding, and a molded article manufactured therefrom are also provided.
Public/Granted literature
- US20210087371A1 Latex Composition for Dip Molding, a Method of Preparing the Same, and Molded Article Therefrom Public/Granted day:2021-03-25
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