Invention Grant
- Patent Title: Film-forming apparatus and film-forming method
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Application No.: US16171522Application Date: 2018-10-26
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Publication No.: US11492702B2Publication Date: 2022-11-08
- Inventor: Manabu Honma , Yuka Nakasato
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2017-214122 20171106
- Main IPC: C23C16/455
- IPC: C23C16/455 ; H01L21/02 ; C23C16/52 ; C23C16/34 ; B05C9/08 ; B05C9/12

Abstract:
An apparatus for forming a thin film by repeating, plural times, a cycle including supplying and adsorbing a precursor gas onto a substrate and generating a reaction product by allowing the precursor gas on the substrate to react with a reaction gas, which includes: a main precursor gas supply part for supplying the precursor gas; a reaction gas supply part for supplying the reaction gas; an adjustment-purpose precursor gas supply part for supplying an adjustment-purpose precursor gas to adjust an in-plane film thickness distribution of the thin film; and a controller for outputting a control signal to execute a step of forming the thin film using the main precursor gas supply part and the reaction gas supply part, and subsequently a step of supplying the adjustment-purpose precursor gas from the adjustment-purpose precursor gas supply part to compensate for a film thickness of a portion having a relatively thin film thickness.
Public/Granted literature
- US20190136377A1 FILM-FORMING APPARATUS AND FILM-FORMING METHOD Public/Granted day:2019-05-09
Information query
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