Invention Grant
- Patent Title: Heat pipe module and heat dissipating device using the same
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Application No.: US17147334Application Date: 2021-01-12
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Publication No.: US11493280B2Publication Date: 2022-11-08
- Inventor: Chien-Hung Sun , Te-Hsuan Chin
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Maschoff Brennan
- Priority: CN201610114384.9 20160301
- Main IPC: F28D15/02
- IPC: F28D15/02 ; H05K7/20 ; F28D15/04 ; F28F1/02
Abstract:
A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
Public/Granted literature
- US20210131743A1 HEAT PIPE MODULE AND HEAT DISSIPATING DEVICE USING THE SAME Public/Granted day:2021-05-06
Information query
