Invention Grant
- Patent Title: Liquid layer thickness measurement method, measurement device, film production method
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Application No.: US17054826Application Date: 2019-05-27
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Publication No.: US11493327B2Publication Date: 2022-11-08
- Inventor: Kenta Nakajima , Nobuhiro Naito
- Applicant: Toray Industries, Inc.
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JPJP2018-104586 20180531
- International Application: PCT/JP2019/020843 WO 20190527
- International Announcement: WO2019/230632 WO 20191205
- Main IPC: G01B11/06
- IPC: G01B11/06
Abstract:
A method of measuring thickness of a liquid layer includes applying a light beam to a liquid layer disposed on a surface of a member, detecting reflected light by a sensor, and analyzing the reflected light according to a spectral interference method with a curve fitting technique to determine the thickness of the liquid layer.
Public/Granted literature
- US20210239456A1 LIQUID LAYER THICKNESS MEASUREMENT METHOD, MEASUREMENT DEVICE, FILM PRODUCTION METHOD Public/Granted day:2021-08-05
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