Invention Grant
- Patent Title: Spectral module and method for manufacturing spectral module
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Application No.: US17256918Application Date: 2019-06-17
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Publication No.: US11493386B2Publication Date: 2022-11-08
- Inventor: Takafumi Yokino , Katsuhiko Kato
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2018-129239 20180706
- International Application: PCT/JP2019/023957 WO 20190617
- International Announcement: WO2020/008851 WO 20200109
- Main IPC: H05K3/40
- IPC: H05K3/40 ; G01J3/28 ; G01J3/18 ; H05K1/11 ; H05K3/00

Abstract:
A spectroscopic module includes a support body having a bottom wall portion and a side wall portion surrounding a space on one side of the bottom wall portion, a spectroscopic portion provided on the one side of the bottom wall portion and having a plurality of grating grooves, a photodetector attached to the side wall portion so as to face the spectroscopic portion via the space and having a plurality of photodetection channels, a plurality of first terminals provided on a surface of the support body on a side opposite to the space so as to be disposed along the surface of the support body and electrically connected to the photodetector, and a wiring unit having a plurality of second terminals respectively facing the plurality of first terminals and respectively joined to the plurality of first terminals and a plurality of third terminals respectively and electrically connected to the plurality of second terminals.
Public/Granted literature
- US20210278277A1 SPECTRAL MODULE AND METHOD FOR MANUFACTURING SPECTRAL MODULE Public/Granted day:2021-09-09
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