Invention Grant
- Patent Title: Sensor devices with sensor chip and busbar
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Application No.: US16947910Application Date: 2020-08-24
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Publication No.: US11493538B2Publication Date: 2022-11-08
- Inventor: Rainer Markus Schaller , Juergen Hoegerl , Volker Strutz
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Harrity & Harrity, LLP
- Priority: DE102019123472.7 20190902
- Main IPC: G01R15/20
- IPC: G01R15/20 ; G01R19/00

Abstract:
A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
Public/Granted literature
- US20210063445A1 SENSOR DEVICES WITH SENSOR CHIP AND BUSBAR Public/Granted day:2021-03-04
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