Invention Grant
- Patent Title: Standalone thermal chamber for a temperature control component
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Application No.: US16711106Application Date: 2019-12-11
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Publication No.: US11493550B2Publication Date: 2022-11-08
- Inventor: Daniel G. Scobee , Aleksandr Semenuk , Aswin Thiruvengadam
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H05K7/20 ; H05K1/18

Abstract:
A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.
Public/Granted literature
- US20210181249A1 STANDALONE THERMAL CHAMBER FOR A TEMPERATURE CONTROL COMPONENT Public/Granted day:2021-06-17
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