Invention Grant
- Patent Title: Sensor module
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Application No.: US17209352Application Date: 2021-03-23
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Publication No.: US11495885B2Publication Date: 2022-11-08
- Inventor: Tomoharu Fujii , Takumi Ikeda , Hiroyuki Arai
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD. , National University Corporation YOKOHAMA National University
- Applicant Address: JP Nagano; JP Kanagawa
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.,National University Corporation YOKOHAMA National University
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.,National University Corporation YOKOHAMA National University
- Current Assignee Address: JP Nagano; JP Kanagawa
- Agency: IPUSA, PLLC
- Priority: JPJP2020-056121 20200326,JPJP2021-033266 20210303
- Main IPC: H01Q5/378
- IPC: H01Q5/378 ; H01Q1/38 ; H01Q1/40 ; H01Q13/08 ; H01Q9/04
Abstract:
A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.
Public/Granted literature
- US20210305696A1 SENSOR MODULE Public/Granted day:2021-09-30
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