Invention Grant
- Patent Title: Semiconductor device with spacer of gradually changed thickness and manufacturing method thereof, and electronic device including the semiconductor device
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Application No.: US17112762Application Date: 2020-12-04
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Publication No.: US11502184B2Publication Date: 2022-11-15
- Inventor: Huilong Zhu
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Christensen, Fonder, Dardi & Herbert PLLC
- Priority: CN201911244799.8 20191206
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L21/225 ; H01L21/28 ; H01L29/08 ; H01L29/49 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor device and a manufacturing method thereof, and an electronic device including the semiconductor device. The semiconductor device includes: a substrate; an active region including a first source/drain region, a channel region and a second source/drain region stacked sequentially on the substrate and adjacent to each other; a gate stack formed around an outer periphery of the channel region; and spacers formed around the outer periphery of the channel region, respectively between the gate stack and the first source/drain region and between the gate stack and the second source/drain region; wherein the spacers each have a thickness varying in a direction parallel to a top surface of the substrate.
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Information query
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