Invention Grant
- Patent Title: Method of manufacturing photo sensor
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Application No.: US16887290Application Date: 2020-05-29
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Publication No.: US11502216B2Publication Date: 2022-11-15
- Inventor: Woo-Seok Jeon , Kwang Hyun Kim , Heon Sik Ha
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0138503 20191101
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L27/146 ; H01L31/0224 ; H01L31/105

Abstract:
A method of manufacturing a photo sensor includes forming a first conductive layer on a substrate, the first conductive layer including a metal layer and a transparent conductive oxide layer formed on the metal layer, forming a photoconductive layer on the first conductive layer, forming a second conductive layer on the photoconductive layer, forming a first photoresist pattern on the second conductive layer, etching the second conductive layer using the first photoresist pattern as an etch mask to form a second electrode, deforming the first photoresist pattern to form a second photoresist pattern, and etching the photoconductive layer and the first conductive layer using the second photoresist pattern to form a photoconductive pattern and a first electrode, respectively.
Public/Granted literature
- US20210135039A1 METHOD OF MANUFACTURING PHOTO SENSOR Public/Granted day:2021-05-06
Information query
IPC分类: