Invention Grant
- Patent Title: PCB assembly and manufacturing method thereof
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Application No.: US16759552Application Date: 2019-08-08
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Publication No.: US11503721B2Publication Date: 2022-11-15
- Inventor: Seung-Min Yang , Hak-In Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2018-0101582 20180828
- International Application: PCT/KR2019/010011 WO 20190808
- International Announcement: WO2020/045851 WO 20200305
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H01R12/52 ; H01R12/58 ; H05K1/11

Abstract:
Discussed is a PCB assembly and a manufacturing method of a PCB assembly in which at least two PCBs are electrically connected. The PCB assembly includes a connection metal pin having a body and legs, the body having electric conductivity, and having a pin shape elongated in one direction, a portion of the body being bent according to a predetermined angle of the at least two PCBs arranged in a rotated state, portions of the legs being bent and respectively extended in another direction from opposite ends of the body, the bent and extended portions of the legs being inserted through connection holes respectively formed in the at least two PCBs, and bent and extended terminals of the legs respectively being bent inward to be tightly fixed to lower surfaces of the at least two PCBs.
Public/Granted literature
- US20210176868A1 PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-06-10
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