Invention Grant
- Patent Title: Soft magnetic alloy and magnetic component
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Application No.: US16766161Application Date: 2018-08-21
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Publication No.: US11508502B2Publication Date: 2022-11-22
- Inventor: Akihiro Harada , Akito Hasegawa , Kazuhiro Yoshidome , Kenji Horino , Hiroyuki Matsumoto
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-223787 20171121
- International Application: PCT/JP2018/030732 WO 20180821
- International Announcement: WO2019/102667 WO 20190531
- Main IPC: H01F1/153
- IPC: H01F1/153 ; C22C38/10 ; C22C38/12 ; C22C38/16 ; C22C38/26 ; C22C38/06 ; C22C38/08 ; C22C38/14 ; C22C38/00 ; C22C45/02 ; C21D6/00 ; H01F1/147 ; C22C38/02 ; H01F1/12 ; B22F1/00 ; B22F3/00 ; H01F1/14 ; C22C45/00
Abstract:
A soft magnetic alloy or the like combining high saturated magnetic flux density, low coercive force and high magnetic permeability μ′ having the composition formula (Fe(1−(α+β))X1αX2β)(1−(a+b+c+d+e))BaSibCcCudMe. X1 is one more elements selected from the group consisting of Co and Ni, X2 is one or more elements selected from the group consisting of Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, O and rare earth elements, and M is one or more elements selected from the group consisting of Nb, Hf, Zr, Ta, Ti, Mo, W and V. 0.140
Information query
