Invention Grant
- Patent Title: Package structure having taper-shaped conductive pillar and method of forming thereof
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Application No.: US16886755Application Date: 2020-05-28
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Publication No.: US11508633B2Publication Date: 2022-11-22
- Inventor: Hung-Jui Kuo , Hui-Jung Tsai , Tai-Min Chang , Chia-Wei Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/538 ; H01L25/065 ; H01L23/00
Abstract:
A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers.
Public/Granted literature
- US20210375708A1 PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD OF FORMING THEREOF Public/Granted day:2021-12-02
Information query
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