- Patent Title: Method for forming doped epitaxial layer of contact image sensor
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Application No.: US17142431Application Date: 2021-01-06
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Publication No.: US11508859B2Publication Date: 2022-11-22
- Inventor: Chenchen Qiu , Jun Qian , Chang Sun , Zhengying Wei
- Applicant: Shanghai Huali Microelectronics Corporation
- Applicant Address: CN Shanghai
- Assignee: Shanghai Huali Microelectronics Corporation
- Current Assignee: Shanghai Huali Microelectronics Corporation
- Current Assignee Address: CN Shanghai
- Agency: Banner & Witcoff, Ltd.
- Priority: CN202010861521.1 20200825
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0352 ; H01L27/146

Abstract:
The disclosure discloses a method for forming a doped epitaxial layer of contact image sensor. Epitaxial growth is performed in times. After each time of epitaxial growth, trench isolation and ion implantation are performed to form deep and shallow trench isolation running through a large-thickness doped epitaxial layer. Through cyclic operation of epitaxial growth, trench isolation and ion implantation, the photoresist and hard mask required at each time do not need to be too thick. In the process of trench isolation and ion implantation, the photoresist and etching morphologies are good, such that the lag problem of the prepared contact image sensor is improved. By forming the large-thickness doped epitaxial layer by adopting the method for forming the doped epitaxial layer of the contact image sensor, a high-performance contact image sensor applicable to high quantum efficiency, small pixel size and near infrared/infrared can be prepared.
Public/Granted literature
- US20220069145A1 Method for Forming Doped Epitaxial Layer of Contact Image Sensor Public/Granted day:2022-03-03
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