Invention Grant
- Patent Title: Mounting accuracy measurement chip and mounting accuracy measurement kit
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Application No.: US16967658Application Date: 2018-02-12
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Publication No.: US11510353B2Publication Date: 2022-11-22
- Inventor: Yusuke Yamakage
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/004758 WO 20180212
- International Announcement: WO2019/155643 WO 20190815
- Main IPC: H05K13/08
- IPC: H05K13/08

Abstract:
A mounting accuracy measurement chip includes a chip main body; and one or more protrusions provided on a mounting face of the chip main body, which serve as a contact surface with a mounting target at a position shifted from the mounting face of the chip main body. The one or more protrusions are disposed only within a range defined by a circle whose center is center of gravity of the mounting face and whose radius is half the length of the longest distance from center of gravity to the outer edge of chip main body. Further, a mounting accuracy measurement kit includes the above-mentioned mounting accuracy measurement chip and placement portion, having a degree of adhesiveness, to which the contact surface of mounting accuracy measurement chip, which can be placed, adheres.
Public/Granted literature
- US20210243926A1 MOUNTING ACCURACY MEASUREMENT CHIP AND MOUNTING ACCURACY MEASUREMENT KIT Public/Granted day:2021-08-05
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