Invention Grant
- Patent Title: Package structure, semiconductor device, and formation method for package structure
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Application No.: US17268018Application Date: 2019-08-23
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Publication No.: US11515223B2Publication Date: 2022-11-29
- Inventor: Kazunori Fuji
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2018-160370 20180829
- International Application: PCT/JP2019/033015 WO 20190823
- International Announcement: WO2020/045274 WO 20200305
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00

Abstract:
A package structure includes a metal member and a resin member. The metal member has an obverse surface facing one side in a first direction. The resin member is disposed in contact with at least a portion of the obverse surface. The obverse surface has a roughened area. The roughened area includes a plurality of first trenches recessed from the obverse surface, each of the first trenches having a surface with a greater roughness than the obverse surface. The plurality of first trenches extend in a second direction perpendicular to the first direction and are next to each other in a third direction perpendicular to the first direction and the second direction. The plurality of first trenches are filled up with the resin member.
Public/Granted literature
- US20210166985A1 PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE, AND FORMATION METHOD FOR PACKAGE STRUCTURE Public/Granted day:2021-06-03
Information query
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