Invention Grant
- Patent Title: Multi-segment wire-bond
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Application No.: US16948803Application Date: 2020-10-01
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Publication No.: US11515284B2Publication Date: 2022-11-29
- Inventor: Elmer Cunanan Bayron
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.
Public/Granted literature
- US20220020720A1 MULTI-SEGMENT WIRE-BOND Public/Granted day:2022-01-20
Information query
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