Invention Grant
- Patent Title: Semiconductor light emitting device and method of fabricating the same
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Application No.: US16935356Application Date: 2020-07-22
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Publication No.: US11515449B2Publication Date: 2022-11-29
- Inventor: Jongin Yang , Yongil Kim , Juhyun Kim , Tan Sakong , Jonguk Seo , Suhyun Jo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0150455 20191121
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/62

Abstract:
Semiconductor light emitting devices and methods of fabricating the same are provided. The semiconductor light emitting device includes a light emitting structure, a first electrode, a first dielectric layer, a second electrode, and a vertical conductive pattern. The light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first opening that penetrates the second semiconductor layer and the active layer, the first opening exposing the first semiconductor layer. The first electrode fills at least a portion of the first opening. The first dielectric layer is on the first electrode. The second electrode is on the light emitting structure and covers the first dielectric layer, the second electrode being electrically connected to the second semiconductor layer. The vertical conductive pattern surrounds outer lateral surfaces of the light emitting structure and is electrically connected to the first electrode.
Public/Granted literature
- US20210159365A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-05-27
Information query
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