Invention Grant
- Patent Title: Electromagnetic wave shielding and absorbing molded article
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Application No.: US16760097Application Date: 2018-10-30
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Publication No.: US11515644B2Publication Date: 2022-11-29
- Inventor: Takafumi Ueda , Hirotomo Katano , Hiroshi Katayama
- Applicant: DAICEL POLYMER LTD.
- Applicant Address: JP Tokyo
- Assignee: DAICEL POLYMER LTD.
- Current Assignee: DAICEL POLYMER LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2017-209055 20171030,JPJP2018-043083 20180309,JPJP2018-194176 20181015
- International Application: PCT/JP2018/040244 WO 20181030
- International Announcement: WO2019/088063 WO 20190509
- Main IPC: H01Q17/00
- IPC: H01Q17/00 ; C08K7/06 ; C08J5/04

Abstract:
Provided is an electromagnetic wave shielding and absorbing molded article which has excellent shielding properties and absorbency for electromagnetic waves having a specific frequency. The electromagnetic wave shielding and absorbing molded article includes a thermoplastic resin composition including stainless steel fibers, and the content ratio of the stainless steel fibers in the molded article is from 0.5 to 20 mass %. The electromagnetic wave shielding and absorbing molded article has a thickness from 0.5 mm to 5 mm, and a shielding property of 10 dB or greater and an absorbency of 25% or greater for electromagnetic waves having any frequency in a frequency domain from 59 GHz to 100 GHz.
Public/Granted literature
- US20200335875A1 ELECTROMAGNETIC WAVE SHIELDING AND ABSORBING MOLDED ARTICLE Public/Granted day:2020-10-22
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