Invention Grant
- Patent Title: Electrical connection assembly with high density of contacts
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Application No.: US17765964Application Date: 2020-09-30
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Publication No.: US11515674B2Publication Date: 2022-11-29
- Inventor: François Guillot , Patrice Chetanneau
- Applicant: SAFRAN ELECTRONICS & DEFENSE
- Applicant Address: FR Paris
- Assignee: SAFRAN ELECTRONICS & DEFENSE
- Current Assignee: SAFRAN ELECTRONICS & DEFENSE
- Current Assignee Address: FR Paris
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: FR1910927 20191002
- International Application: PCT/EP2020/077295 WO 20200930
- International Announcement: WO2021/063984 WO 20210408
- Main IPC: H01R13/28
- IPC: H01R13/28 ; H01R13/6585 ; H01R12/58

Abstract:
An electrical connection assembly including two complementary connectors, each including a mutually parallel electrically insulating plates each comprising one face carrying signal transport contacts and an opposite face carrying at least one shielding sheet in such a manner that, when the connectors are connected together, the plates are interleaved between one another so that the contacts are pressed against one another and the shielding sheets are pressed against each other.
Public/Granted literature
- US20220352676A1 ELECTRICAL CONNECTION ASSEMBLY WITH HIGH DENSITY OF CONTACTS Public/Granted day:2022-11-03
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