Invention Grant
- Patent Title: Printed circuit board and electronic device having the same
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Application No.: US17125512Application Date: 2020-12-17
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Publication No.: US11516912B2Publication Date: 2022-11-29
- Inventor: Jongmin Jeon , Eunseok Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2019-0170081 20191218
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/18 ; H05K3/46 ; H05K3/36 ; H05K3/02

Abstract:
Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.
Public/Granted literature
- US20210195736A1 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2021-06-24
Information query