Invention Grant
- Patent Title: Heat sink and printed circuit board arrangements for data storage systems
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Application No.: US17025968Application Date: 2020-09-18
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Publication No.: US11516941B2Publication Date: 2022-11-29
- Inventor: Mohamad El-Batal , David Copeland
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Faegre Drinker Biddle & Reath LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02

Abstract:
A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.
Public/Granted literature
- US20220095487A1 HEAT SINK AND PRINTED CIRCUIT BOARD ARRANGEMENTS FOR DATA STORAGE SYSTEMS Public/Granted day:2022-03-24
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