A method for the magnetic pulse soldering of an item having a stack of sheets consisting of a metal material. At least one hole through a thickness of the stack is formed. The first and second plates, both consisting of a metal material, are arranged on either side of the stack. A covering area covering at least one through-hole is formed. The plates-stack assembly is positioned opposite an active part of a coil such that a working area of the covering area faces the active part of the coil and the working area covering at least one hole. The working area is subjected to a magnetic field until the assembly is joined. While the working area is subjected to the magnetic field, pressure is exerted on the first plate, in the region of at least one hole, pressing the first plate against the second plate.