Invention Grant
- Patent Title: Substrate with electrical connection section, substrate for liquid ejection head and methods of manufacturing the same
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Application No.: US17005109Application Date: 2020-08-27
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Publication No.: US11518164B2Publication Date: 2022-12-06
- Inventor: Teruo Ozaki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Priority: JPJP2019-158553 20190830
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A substrate with an electrical connection section or a substrate for liquid ejection head comprises a wiring layer, a diffusion prevention layer laid on the wiring layer and a connection member laid on the diffusion prevention layer for establishing an electrical connection to an outside. An insulation layer having a wiring-layer-exposing opening is arranged on the wiring layer and the diffusion prevention layer is arranged in the opening, while the connection member is arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer.
Public/Granted literature
Information query
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