Invention Grant
- Patent Title: Packaging material grading and/or factory profiles
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Application No.: US17015372Application Date: 2020-09-09
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Publication No.: US11518557B2Publication Date: 2022-12-06
- Inventor: Patrick R. Lancaster, III
- Applicant: Lantech.com, LLC
- Applicant Address: US KY Louisville
- Assignee: Lantech.com, LLC
- Current Assignee: Lantech.com, LLC
- Current Assignee Address: US KY Louisville
- Agency: Middleton Reutlinger
- Main IPC: B65B11/04
- IPC: B65B11/04 ; B65B57/04 ; B65B11/00 ; B65B59/00
Abstract:
Control of a load wrapping apparatus may be based at least in part on packaging material grading and/or factory profiles.
Public/Granted literature
- US20210086927A1 PACKAGING MATERIAL GRADING AND/OR FACTORY PROFILES Public/Granted day:2021-03-25
Information query
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