A package structure comprises a backing plate supporting a target object, at least one pad disposed on the backing plate and fixing the target object, a frame disposed on a lower side of the backing plate, bonded to the backing plate, and supporting the backing plate to fix the pad onto the backing plate, and a side enclosing plate disposed around the backing plate and connected to the pad to fix the pad. The package structure further comprises a magnetic component disposed on the backing plate and attracting a magnetic coating on the target object.