Invention Grant
- Patent Title: Composition for forming silica layer, manufacturing method for silica layer, and silica layer
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Application No.: US16645343Application Date: 2018-02-13
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Publication No.: US11518909B2Publication Date: 2022-12-06
- Inventor: Kunbae Noh , Taeksoo Kwak , Junyoung Jang , Yoonyoung Koo , Yonggoog Kim , Jingyo Kim , Jin-Hee Bae , Jun Sakong , Jinwoo Seo , Sooyeon Sim , Huichan Yun , Jiho Lee , Kwen-Woo Han , Byeong Gyu Hwang
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0133531 20171013
- International Application: PCT/KR2018/001880 WO 20180213
- International Announcement: WO2019/074167 WO 20190418
- Main IPC: C09D183/16
- IPC: C09D183/16 ; H01L21/02 ; H01L21/306
Abstract:
Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.
Public/Granted literature
- US20200369915A1 COMPOSITION FOR FORMING SILICA LAYER, MANUFACTURING METHOD FOR SILICA LAYER, AND SILICA LAYER Public/Granted day:2020-11-26
Information query
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