Invention Grant
- Patent Title: Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate
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Application No.: US16982940Application Date: 2019-02-28
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Publication No.: US11518911B2Publication Date: 2022-12-06
- Inventor: Yukinobu Yoshizaki , Yohei Takahashi , Yohei Nakata
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Aichi
- Agency: Katten Munchin Roseman LLP
- Priority: JPJP2018-055682 20180323
- International Application: PCT/JP2019/007850 WO 20190228
- International Announcement: WO2019/181419 WO 20190926
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14 ; B24B37/00 ; H01L21/306 ; H01L21/3105 ; H01L21/321 ; H01L21/768

Abstract:
The present invention provides, in polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, means that is capable of improving a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials.
The present invention relates to a polishing composition used for polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, the polishing composition containing: organic acid-immobilized silica; a dispersing medium; a selection ratio improver that improves a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials; and an acid, in which the selection ratio improver is organopolysiloxane having a hydrophilic group.
The present invention relates to a polishing composition used for polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, the polishing composition containing: organic acid-immobilized silica; a dispersing medium; a selection ratio improver that improves a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials; and an acid, in which the selection ratio improver is organopolysiloxane having a hydrophilic group.
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