Invention Grant
- Patent Title: Method of assembling fastener structure on plate body
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Application No.: US17155165Application Date: 2021-01-22
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Publication No.: US11519438B2Publication Date: 2022-12-06
- Inventor: Ting-Jui Wang
- Applicant: FIVETECH TECHNOLOGY INC.
- Applicant Address: TW New Taipei
- Assignee: FIVETECH TECHNOLOGY INC.
- Current Assignee: FIVETECH TECHNOLOGY INC.
- Current Assignee Address: TW New Taipei
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: TW107115334 20180504
- Main IPC: H05K3/20
- IPC: H05K3/20 ; F16B5/02 ; F16B41/00

Abstract:
A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.
Public/Granted literature
- US20210148390A1 METHOD OF ASSEMBLING FASTENER STRUCTURE ON PLATE BODY Public/Granted day:2021-05-20
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