Invention Grant
- Patent Title: Plate heat exchanger and heat pump device including the same
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Application No.: US16971697Application Date: 2019-02-28
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Publication No.: US11519673B2Publication Date: 2022-12-06
- Inventor: Susumu Yoshimura , Faming Sun , Yoshitaka Eijima , Sho Shiraishi , Masahiro Yokoi , Ryosuke Abe , Kazutaka Suzuki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2018-047956 20180315
- International Application: PCT/JP2019/007859 WO 20190228
- International Announcement: WO2019/176567 WO 20190919
- Main IPC: F28D9/00
- IPC: F28D9/00 ; F28F3/06 ; F28F3/08

Abstract:
A plate heat exchanger includes heat transfer plates each of which has openings at four corners thereof, and which are stacked together. The heat transfer plates are partially brazed together such that a first flow passage through which first fluid flows and a second flow passage through which second fluid flows are alternately arranged, with an associated heat transfer plate interposed between the first and second flow passages. The openings at each of the four corners communicate with each other, thereby forming a first header and a second header, the first header allowing the first fluid to flow into and flow out of the first flow passage, the second header allowing the second fluid to flow into and flow out of the second flow passage.
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